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RA6992-BL SMT Planar Transformer

for Texas Instruments UCC2897

RoHS compliant
  • Developed for TI UCC2897 Active Clamp Forward (PMP9656 Reference Design)
  • Provides 0.009 inch (0.229 mm) clearance above the seating plane
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Typical Application

Works with Texas Instruments UCC2897

Input Voltage Output Power
48 V 60 V 12 V , 21 A 250 W

Specifications

Electrical specifications at 25°C.

Part number Inductance
at 0A (µH) 1
(Tolerance: ±20%)
DCR max (mΩ) 2 Leakage
Inductance
max (µH) 3
Turns Ratio Volt-time
product (V-µs) 4
Isolation
Voltage (Vrms) 5
Pri Sec Aux Pri : Sec : Aux
RA6992-BL 50 6.9 4.2 82.0 0.25 1 : 0.5 : 0.5 206 1500
Notes
  1. Inductance measured on an Agilent/HP 4284 at 200 kHz, 0.5 Vrms, 0 Adc with windings connected in parallel.
  2. DCR for primary is measured with the windings connected in parallel. DCR for secondary is measured between pins 7 and 11.
  3. Leakage inductance is for the primary with windings connected in parallel, measured at 200 kHz, 0.5 Vrms, 0 Adc with all secondary pins shorted.
  4. Volt-time product is based on primary windings connected in parallel.
  5. 1500 Vrms, one minute isolation (hipot) from primary to secondary.

Termination:

  • RoHS-compliant  260°C compatible. Matte tin over nickel over brass terminations.
Environmental
Environmental:
RoHS compliant
Ambient temperature range:
–40°C to +85°C
Storage temperature range:
Component: –40°C to +125°C
Tray packaging: –40°C to +80°C
Maximum part temperature:
+125°C (ambient + temp rise)
Failures in Time (FIT) / Mean Time Between Failures (MTBF):
38 per billion hours / 26,315,789 hours, calculated per Telcordia SR-332

Schematics

ra6992s.gif

Primary windings to be connected
in parallel on the PC board.

Physical characteristics

ra6992d.gif

dims_inches_mm.gif

General specification

Core Material:
Ferrite
Weight:
26.5 g
Packaging:
25 per tray

Soldering/Washing

Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity)
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles
Refer to Soldering Coilcraft Components before soldering.
PCB Washing:
Tested to MIL-STD-202 Method 215 plus an additional aqueous wash. More info.

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