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NA5738-DL SMT Planar Transformer

for Texas Instruments UCC2897

RoHS compliant
  • Developed for TI UCC2897 Active Clamp (PMP7376 Reference Design)
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Count Unit price
1 $13.45
100 $13.18
250 $9.89
500 $5.93
1000 $4.61

For high volume or non-stock items, request a quote.

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Typical Application

Works with Texas Instruments UCC2897

Input Voltage Output 1 Power
52 V 60 V 12 V , 22 A 264 W

Specifications

Electrical specifications at 25°C.

Part number Inductance
at 0A (µH) 2
(Tolerance: ±20%)
DCR max (mΩ) 3 Leakage
Inductance
max (µH) 4
Turns Ratio Volt-time
product (V-µs) 5
Isolation
Voltage (Vrms) 6
Pri Sec Aux Pri : Sec : Aux
NA5738-DL 100 4.8 1.7 18.0 0.18 1 : 0.4 : 0.4 94.5 1500
Notes
  1. Output of the aux winding is 12 V.
  2. Inductance is for the primary, measured on Agilent/HP 4284A at 200 kHz, 0.5 Vrms, 0 Adc.
  3. DCR measured at 25°C. For other operating temperatures, use this DCR at Temperature calculator.
  4. Leakage Inductance is for the primary, measured at 100 kHz, 0.1 Vrms, 0 Adc with secondary pins shorted.
  5. Volt-time product is based on primary turns and 3000 gauss.
  6. 1500 Vrms, one minute isolation (hipot) from primary to secondary.

Termination:

  • RoHS-compliant  260°C compatible. Matte tin over nickel over brass.
Environmental
Environmental:
RoHS compliant
Ambient temperature range:
–40°C to +125°C
Storage temperature range:
Component: –40°C to +155°C
Tray packaging: –40°C to +80°C
Maximum part temperature:
+155°C (ambient + temp rise)
Failures in Time (FIT) / Mean Time Between Failures (MTBF):
38 per billion hours / 26,315,789 hours, calculated per Telcordia SR-332

Schematics

na5738s.gif

Physical characteristics

na5738d.gif

dims_inches_mm.gif

General specification

Core Material:
Ferrite
Weight:
22.0 g
Packaging:
36 per tray

Soldering/Washing

Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity)
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles
Refer to Soldering Coilcraft Components before soldering.
PCB Washing:
Tested to MIL-STD-202 Method 215 plus an additional aqueous wash. More info

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