Datasheet 3D Model

PFC Boost Inductor

for ON Semiconductor NCP1606

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Electrical specifications at 25°C.

Part number (Hover for schematics)	Inductance at 0A (µH) 1 (Tolerance: ±10%)	Isat (A) 2	DCR max (Ω) 3		Turns Ratio	Irms (A) 5	Isolation Voltage (Vrms) 6
Part number (Hover for schematics)	Inductance at 0A (µH) 1 (Tolerance: ±10%)	Isat (A) 2	Pri (Ω)	Aux (mΩ)	Pri : Aux	Irms (A) 5	Isolation Voltage (Vrms) 6
GA2972-ALD	330	4.8	0.30	350.00	1 : 0.125	2.3	500

Notes

Inductance measured at 100 kHz, 0.1 V, 0 Adc using an Agilent/HP 4263B impedance analyzer or equivalent.
Isat: DC current at 25°C that causes the specified inductance drop from its value without current.
DCR measured at 25°C. For other operating temperatures, use this DCR at Temperature calculator.
SRF tested on an Agilent/HP 4192A.
Irms: Current that causes the specified temperature rise from 25°C ambient. This information is for reference only and does not represent absolute maximum ratings.
500 Vrms isolation winding to winding and from each winding to the core.

RoHS compliant tin-silver over tin over nickel over phos bronze. Other terminations available at additional cost.

Environmental

Environmental:

RoHS compliant

Ambient temperature range:

−40°C to +85°C with (40°C) Irms current.

Storage temperature range:

Component: −40°C to +85°C
Packaging trays: −40°C to +80°C

Maximum part temperature:

+125°C (Ambient + temperature rise)

Failures in Time (FIT) / Mean Time Between Failures (MTBF):

Core Material:

Ferrite

Weight:

27 g

Packaging:

24 parts per tray

Moisture Sensitivity Level (MSL):

1 (unlimited floor life at <30°C / 85% relative humidity)

Resistance to soldering heat:

Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles

Refer to Soldering Coilcraft Components before soldering.

PCB Washing:

Tested to MIL-STD-202 Method 215 plus an additional aqueous wash. More info.