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PFC Boost Inductor

for ON Semiconductor NCP1606

RoHS compliant
  • Developed for ON Semiconductor NCP1606 PFC controller
  • Referenced as LBOOSTin application note AND8282/D
  • Designed to operate in 100 Watt applications
  • Auxiliary winding provides Zero Current Detection (ZCD) information

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Specifications

Electrical specifications at 25°C.

Part number
(Hover for schematics)
Inductance
at 0A (µH) 1
(Tolerance: ±10%)
Isat (A) 2 DCR max (Ω) 3 Turns Ratio Irms (A) 5 Isolation
Voltage (Vrms) 6
Pri Aux Pri : Aux
GA2972-AL 330 4.8 0.30 0.35 1 : 0.125 2.3 500
Notes
  1. Inductance measured at 100 kHz, 0.1 V, 0 Adc using an Agilent/HP 4263B impedance analyzer or equivalent.
  2. Isat: DC current at 25°C that causes the specified inductance drop from its value without current.
  3. DCR measured at 25°C. For other operating temperatures, use this DCR at Temperature calculator.
  4. SRF tested on an Agilent/HP 4192A.
  5. Irms: Current that causes the specified temperature rise from 25°C ambient. This information is for reference only and does not represent absolute maximum ratings.
  6. 500 Vrms isolation winding to winding and from each winding to the core.

Termination:

  • RoHS compliant tin-silver over tin over nickel over phos bronze. Other terminations available at additional cost.
Environmental
Environmental:
RoHS compliant
Ambient temperature range:
−40°C to +85°C with (40°C) Irms current.
Storage temperature range:
Component: −40°C to +85°C
Packaging trays: −40°C to +80°C
Maximum part temperature:
+125°C (Ambient + temperature rise)
Failures in Time (FIT) / Mean Time Between Failures (MTBF):

Performance curves

L vs Frequency

L vs Current

Irms Derating

Schematics

ga2972s.gif

Physical characteristics

ga2972d.gif
dims_inches_mm.gif

General specification

Core Material:
Ferrite
Weight:
27 g
Packaging:
24 parts per tray

Soldering/Washing

Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity)
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles
Refer to Soldering Coilcraft Components before soldering.
PCB Washing:
Tested to MIL-STD-202 Method 215 plus an additional aqueous wash. More info.

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