Datasheet 3D Model

Q4339-BL

Name: Q4339-BL
Brand: Coilcraft
SKU: Q4339-BL
Price: 3.56 USD
Availability: InStock

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Count	Unit price
1	$7.24
250	$5.09
500	$4.57
1000	$3.56
2500	$3.05
5000	$2.82

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Typical Application

Works with Texas Instruments LM258X (T6)

Input Voltage	Output		Power	Fsw
Input Voltage	Sec1	Sec2	Power	Fsw
18 V — 36 V	12 V , 0.63 A	12 V , 0.63 A	15.1 W	100 kHz

Specifications

Electrical specifications at 25°C.

Part number (Hover for schematics)	Inductance at 0A (µH) (Tolerance: ±15%)	Inductance min at 3 A (µH)	DCR max 1			Leakage Inductance max (µH) 2	Turns Ratio	Volt-time product (V-µs)	Isolation Voltage (Vrms) 3
Part number (Hover for schematics)	Inductance at 0A (µH) (Tolerance: ±15%)	Inductance min at 3 A (µH)	Pri (Ω)	Sec1 (mΩ)	Sec2 (mΩ)	Leakage Inductance max (µH) 2	Pri : Sec1 : Sec2	Volt-time product (V-µs)	Isolation Voltage (Vrms) 3
Q4339-BL	66.0	59.4	0.09	200.00	240.00	3.0	1 : 1.2 : 1.2	499.5	500

Notes

DCR measured at 25°C. For other operating temperatures, use this DCR at Temperature calculator.
Leakage inductance measured across the primary at 0.10 Vrms, 100 kHz.
500 Vrms isolation between windings.

Termination:

RoHS-compliant – Tin-silver over tin over nickel over phos bronze.
COTS Plus tin-silver-copper and tin-lead terminations available.

Environmental

Environmental:

RoHS compliant

Ambient temperature range:

–40°C to +85°C

Storage temperature range:

Component: –40°C to +85°C
Tray packaging: –40°C to +80°C

Failures in Time (FIT) / Mean Time Between Failures (MTBF):

See FIT/MTBF Calculations

Schematics

Physical characteristics

General specification

Core Material:

Ferrite

Weight:

11.6 g

Packaging:

100 parts per tray

Soldering/Washing

Moisture Sensitivity Level (MSL):

1 (unlimited floor life at <30°C / 85% relative humidity)

Resistance to soldering heat:

Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles

Refer to Soldering Coilcraft Components before soldering.

PCB Washing:

Tested with pure water or alcohol only. More info.

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