Datasheet 3D Model

MA5157 Flyback Transformer

for NXP Semiconductor SSL2103 SMPS Controller

Developed for use with NXP Semiconductor SSL2103 SMPS Controller for dimmable LED lighting

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Count	Unit price
1	$4.53
100	$3.88
500	$3.41
1000	$2.62
2500	$2.25

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Typical Application

Works with NXP SSL2103

AC Input Voltage	Output		Power	Fsw
AC Input Voltage	Sec	Aux	Power	Fsw
85 V — 130 V	23 V , 0.74 A	19 V , 0.02 A	17 W	100 kHz

Specifications

Electrical specifications at 25°C.

Part number (Hover for schematics)	Inductance at 0A (µH) 1 (Tolerance: ±10%)	Inductance min at 1.2 A (µH)	DCR max 2			Leakage Inductance max (µH) 3	Turns Ratio	Isolation Voltage (Vrms) 4
Part number (Hover for schematics)	Inductance at 0A (µH) 1 (Tolerance: ±10%)	Inductance min at 1.2 A (µH)	Pri (Ω)	Sec (mΩ)	Aux (mΩ)	Leakage Inductance max (µH) 3	Pri : Sec : Aux	Isolation Voltage (Vrms) 4
MA5157-AL	750	635	0.880	95.000	585.000	20.5	1 : 0.23 : 0.2	2000

Notes

Inductance is for the primary, measured at 100 kHz, 0.1 Vrms.
DCR for the primary is measured with the windings connected in parallel. DCR measured at 25°C. For other operating temperatures, use this DCR at Temperature calculator.
Leakage inductance is for the primary winding, measured at 100 kHz, 0.1 Vrms with the secondary winding shorted.
2000 Vrms, one minute isolation from primary and auxiliary to secondary windings.

Termination:

RoHS-compliant. Tin-silver over tin over copper over steel termination. Other terminations available at additional cost.

Environmental

Environmental:

RoHS compliant

Ambient temperature range:

–40°C to +85°C

Storage temperature range:

−40°C to +85°C
7 Storage temperature range: Component: −40°C to +125°C
Packaging tray: −40°C to +80°C

Maximum part temperature:

+125°C (ambient + temp rise)

Failures in Time (FIT) / Mean Time Between Failures (MTBF):

See FIT/MTBF Calculations

Schematics

Physical characteristics

General specification

Core Material:

Ferrite

Weight:

11.8 g

Soldering/Washing

Moisture Sensitivity Level (MSL):

1 (unlimited floor life at <30°C / 85% relative humidity)

Resistance to soldering heat:

Three reflows at >217°C for 90 seconds (+260°C ±5°C for 20 – 40 seconds), allowing parts to cool to room temperature between.

Refer to Soldering Coilcraft Components before soldering.

PCB Washing:

Tested to MIL-STD-202 Method 215 plus an additional aqueous wash. More info.

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