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Cx Family Common Mode Chokes
0402CT Low Profile Chip Inductors
XAL7050 High-inductance Shielded Power Inductors
XGL4020 Ultra-low DCR Power Inductors

Flyback Transformers

for Microchip Grid-Connected Solar Micro Inverter

RoHS compliant
  • Developed for Microchip for their Grid-Connected Solar Microinverter using dsPIC
  • For 220 Vac applications, KA4823-BL has been replaced by KA4823-CL, which has a higher SRF and higher efficiency.
  • Listed on Bill of Material for Reference Design AN1338

Buy Now:
Count Unit price
1 $17.81
100 $15.27
500 $11.02
1000 $9.59
2500 $8.23
5000 $7.53

For high volume or non-stock items, request a quote.

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Typical Application

Works with Microchip AN1338

Part number Input Voltage Output Fsw
JA4635-AL 22 V 55 V 110 V 150 kHz
KA4823-CL 22 V 55 V 220 V 150 kHz


Electrical specifications at 25°C.

Part number 1
(Hover for schematics)
at 0A (µH)
(Tolerance: ±10%)
Isat (A) 2 DCR max (Ω) 3 Leakage
max (µH) 4
Turns Ratio 5 Isolation
Voltage (Vrms) 6
Pri Sec Pri : Sec
JA4635-AL 28 10.5 0.008 0.106 0.138 1 : 6 3000
KA4823-CL 28 10.5 0.008 0.472 0.115 1 : 12 3000
  1. Inductance is measured at 150 kHz, 0.1 Vrms.
  2. DC current at which the inductance drops 10% (typical) from its value without current.
  3. DCR is with the secondary windings connected in parallel.
  4. Leakage inductance is for the three windings of the primary with the secondary windings shorted.
  5. Turns ratios are with the primary and secondary windings connected in parallel.
  6. 3000 Vrms, one minute primary to secondary isolation.


  • RoHS-compliant. Tin-silver (96.5/3.5) over tin cover copper-plated steel wire terminations.
RoHS compliant
Ambient temperature range:
–40°C to +85°C
Storage temperature range:
Component: –40°C to +85°C.
Tray packaging: –40°C to +80°C
Failures in Time (FIT) / Mean Time Between Failures (MTBF):



Physical characteristics



General specification

Core Material:
94.3 g
20 per tray


Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity)
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles
Refer to Soldering Coilcraft Components before soldering.
PCB Washing:
Tested to MIL-STD-202 Method 215 plus an additional aqueous wash. See Doc787_PCB_Washing.pdf.