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SMT Gate Drive Transformer for
TI UCD3138 Digital Power Controllers

  • Selected by Texas Instruments for their UCD3138 evaluation boards
  • Designed to meet UL/CSA/IEC 60950 Reinforced Insulation; 3 mm creepage/clearance
  • 3000 Vrms interwinding isolation; 500 Vrms windings to core isolation
  • RoHS-compliant. 260°C compatible. Tin-silver (96.5/3.5) over tin over nickel over phos bronze terminations

SPECIFICATIONS


Part number1
Click to get parts
Turns ratio Primary
Inductance2
±20% (µH)
Leakage
inductance3
max (µH)
DCR max4
(Ohms)
Volt-time
product5
(V-µsec)
SRF typ6
(MHz)
Capacitance
max (pF)
GA3550-BL_ 1 : 1 : 1 460 1.15 (Pri [A])
1.25 (Pri [B])
0.410 (Pri [A])
0.475 (Pri [B])
0.440 (sec)
165 5.85 34.0 (1–10)
10.5 (1–5)
1 When ordering, please specify packaging code: e.g. GA3550-BLD
Packaging: D = 13" reel, machine-ready 
EIA-481 embossed plastic tape (200 parts per full reel).
B = Less than full reel
In tape, but not machine-ready. To have a leader and trailer added ($25 charge), use code letter D instead.
2 Inductance is for each winding measured at 200 kHz, 0.4 Vrms, 0 Adc.
3 Leakage inductance is for the primary, measured at 200 kHz, 0.4 Vrms with the secondary winding shorted.
4 DCR measured at 25°C. For other operating temperatures, use this DCR at Temperature calculator.
5 Volt-time product is per winding.
6 SRF is per winding, measured on an Agilent/HP 4192 or equivalent.
7 Ambient temperature range: −40°C to +85°C
8 Storage temperature range: Component: −40°C to +125°C
Tape and reel packaging: −40°C to +80°C
9 Maximum part temperature: +125°C (ambient + temp rise)
10 Resistance to soldering heat: Three reflows at >217°C for 90 seconds (+260°C ±5°C for 20 – 40 seconds), allowing parts to cool to room temperature between.
11 Electrical specifications at 25°C.
Refer to Soldering Coilcraft Components before soldering.
PCB washing: Tested to MIL-STD-202 Method 215 plus an additional aqueous wash. More info.

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Updated: October 30, 2017