Datasheet

ZA9710-AED Flyback Transformer for Texas Instruments

Designed for UCC5870-Q1 IGBT/SiC isolated gate driver for Texas Instruments
Optimized for 300kHz with 4.5 – 70 V input
3000 Vrms, 1 minute isolation (hipot) between primary and secondary
RoHS-compliant. 260°C compatible. Tin-silver-copper over tin over nickel over phos bronze terminations
AEC-Q200 Grade 1 (–40°C to +125°C)

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典型应用

与Texas Instruments UCC5870-Q1一起使用

输入电压	输出		功率	Fsw
输入电压	Sec1	Sec2	功率	Fsw
4.5 V — 70 V	15 V , 0.2 A	8 V , 0.2 A	4.6 W	300 kHz

规格

Electrical specifications at 25°C.

零件号 (Hover for schematics)	0A时的电感 (µH) 1 (公差: ±10%)	Isat (A)	DCR max			最大漏电感 (µH) 3	匝数比	隔离电压 (Vrms) 4
零件号 (Hover for schematics)	0A时的电感 (µH) 1 (公差: ±10%)	Isat (A)	Pri (Ω)	Sec1 (mΩ)	Sec2 (mΩ)	最大漏电感 (µH) 3	Pri : Sec1 : Sec2	隔离电压 (Vrms) 4
ZA9710-AED	30.0	3.3	0.169	324.000	190.000	0.350	1 : 1 : 0.53	3000

注释

Inductance is for the primary, measured at 300 kHz, 0.1 Vrms, 0 Adc.
DC current that causes the primary inductance drop 30% from its value without current.
Leakage inductance is for the primary and is measured with the secondary shorted.
3000 Vrms, one minute isolation (hipot) between primary and secondary.

端子:

RoHS tin-silver-copper over tin over nickel over phos bronze. Other terminations available at additional cost.

包装:

D = 13″ machine-ready reel. EIA-481 embossed plastic tape (350 parts per full reel). Quantities less than full reel available: in tape (not machine ready) or with leader and trailer ($25 charge).

环境

环境:

符合RoHS , 无卤素

环境温度范围:

–40°C to +125°C

储存温度范围:

Component: –40°C to +125°C
Tape and reel packaging: –40°C to +80°C

最高元件温度:

+165°C (ambient + temp rise)

故障率（FIT）/平均故障间隔时间（MTBF）:

See FIT/MTBF Calculations

原理图

物理特性

卷装规格

Parts per reel	Reel dimensions (mm)					Tape dimensions (mm)						Orientation
13" (330 mm)	A	B	C	D	E	W	P	Po	P1	H	T
350	330	100	13	30,4	24,4	24	16	4	2	10,4	0,5

一般规格

核心材料:

Ferrite

重量:

2.7 g

包装:

350 per 13″ reel Plastic tape: 24 mm wide, 0.5 mm thick, 16 mm pocket spacing, 10.4 mm pocket depth

焊接/清洗

湿气敏感度等级（MSL）:

1 (unlimited floor life at <30°C / 85% relative humidity)

抗焊接热:

Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles

焊接之前，请参阅焊接线艺元件。

PCB清洗:

Tested to MIL-STD-202 Method 215 plus an additional aqueous wash. See Doc787_PCB_Washing.

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