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Cx Family Common Mode Chokes
0402CT Low Profile Chip Inductors
XAL7050 High-inductance Shielded Power Inductors
XGL4020 Ultra-low DCR Power Inductors

Flyback Transformers

for Microchip Grid-Connected Solar Micro Inverter

符合RoHS
  • Developed for Microchip for their Grid-Connected Solar Microinverter using dsPIC
  • For 220 Vac applications, KA4823-BL has been replaced by KA4823-CL, which has a higher SRF and higher efficiency.
  • Listed on Bill of Material for Reference Design AN1338
立即购买:
计数 单价
1 $16.80
100 $13.45
500 $9.71
1000 $8.44
2500 $7.25
5000 $6.63

对于大批量采购或非库存产品,点击这里请求报价

. 现货,可今天发货.
索取样品:

典型应用

与Microchip AN1338一起使用

零件号 输入电压 输出 Fsw
JA4635-AL 22 V 55 V 110 V 150 kHz
KA4823-CL 22 V 55 V 220 V 150 kHz

规格

Electrical specifications at 25°C.

零件号 1 0A时的
电感 (µH)
(公差: ±10%)
Isat (A) 2 DCR max (Ω) 3 最大
漏电感
(µH) 4
匝数比 5 隔离
电压 (Vrms) 6
Pri Sec Pri : Sec
JA4635-AL 28 10.5 0.008 0.106 0.138 1 : 6 3000
KA4823-CL 28 10.5 0.008 0.472 0.115 1 : 12 3000
注释
  1. Inductance is measured at 150 kHz, 0.1 Vrms.
  2. DC current at which the inductance drops 10% (typical) from its value without current.
  3. DCR is with the secondary windings connected in parallel.
  4. Leakage inductance is for the three windings of the primary with the secondary windings shorted.
  5. Turns ratios are with the primary and secondary windings connected in parallel.
  6. 3000 Vrms, one minute primary to secondary isolation.

端子:

  • RoHS-compliant. Tin-silver (96.5/3.5) over tin cover copper-plated steel wire terminations.
环境
环境:
符合RoHS
环境温度范围:
–40°C to +85°C
储存温度范围:
Component: –40°C to +85°C.
Tray packaging: –40°C to +80°C
故障率(FIT)/平均故障间隔时间(MTBF):
38 per billion hours / 26,315,789 hours, calculated per Telcordia SR-332

原理图

ja4635s.gif

物理特性

ja4635d.gif

dims_inches_mm-(6).gif

一般规格

核心材料:
Ferrite
重量:
94.3 g
包装:
20 per tray

焊接/清洗

湿气敏感度等级(MSL):
1 (unlimited floor life at <30°C / 85% relative humidity)
抗焊接热:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles
焊接之前,请参阅焊接线艺元件
PCB清洗:
Tested to MIL-STD-202 Method 215 plus an additional aqueous wash. See Doc787_PCB_Washing.pdf.