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Cx Family Common Mode Chokes
0402CT Low Profile Chip Inductors
XAL7050 High-inductance Shielded Power Inductors
XGL4020 Ultra-low DCR Power Inductors

RFB1010-123

RFB1010-123L

符合RoHS AEC-Q flag
We will continue to manufacture and support the all values of the RFB1010 series indefinitely, however, for values >56 µH we recommend the RFC1010 for new designs. The RFC series is a halogen-free, drop-in replacement for the RFB and offers lower DCR and better current ratings.

有关该元件的更多信息和规格。

前往系列
立即购买:
计数 单价
1 $1.72
150 $1.40
300 $1.05
600 $0.64
1050 $0.49
2550 $0.43
5100 $0.39
10000 $0.35

对于大批量采购或非库存产品,点击这里请求报价

. 现货,可今天发货.

规格

Electrical specifications at 25°C.

零件号 1 电感 (µH) 2
(公差: ±10%)
DCR max (Ω) 3 SRF typ (kHz) 4 Isat (mA) 5 Irms (mA) 6
20°C rise 40°C rise
RFB1010-123L 12000 22.0 500 170 120 170
注释
  1. When ordering, please specify termination codes: e.g. RFB1010-183L
  2. Inductance tested at 100 kHz, 0.1 Vrms, 0 Adc on an Agilent/HP 4284A LCR-meter or equivalent
  3. DCR at 25°C. For other operating temperatures, use this DCR at Temperature calculator.
  4. SRF measured using an Agilent/HP 4191A or equivalent. Details
  5. Isat: DC current at 25°C that causes a 10% (typ) inductance drop from its value without current. Temperature derating curves.
  6. Irms: Current that causes the specified temperature rise from 25°C ambient. This information is for reference only and does not represent absolute maximum ratings. Temperature derating curves.

端子:

  • L = RoHS compliant tin-silver over tin over copper over steel.
  • T = RoHS tin-silver-copper (95.5/4/0.5). (Special order, added cost)
  • S = non-RoHS tin-lead (63/37). (Special order, added cost)
环境
环境:
符合RoHS
环境温度范围:
−40°C to +85°C with (40°C rise) Irms
储存温度范围:
Component: –40°C to +125°C
Tray packaging: –40°C to +80°C
最高元件温度:
+125°C (Ambient + temperature rise)
故障率(FIT)/平均故障间隔时间(MTBF):

性能曲线

Inductance vs. Current

Inductance vs. Frequency

物理特性

rfb1010d.gif

dims_inches_mm.gif

一般规格

核心材料:
Ferrite
重量:
3.04 – 3.32 g
包装:
150 parts per tray

焊接/清洗

湿气敏感度等级(MSL):
1 (unlimited floor life at <30°C / 85% relative humidity)
抗焊接热:
Three reflows at >217°C for 90 seconds (+260°C ±5°C for 20 – 40 seconds), allowing parts to cool to room temperature between
焊接之前,请参阅焊接线艺元件
PCB清洗:
Tested to MIL-STD-202 Method 215 plus an additional aqueous wash. More info.

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