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Close up of RFB0807-123L
Datasheet 3D Model

RFB0807-123

RFB0807-123L

符合RoHS AEC-Q flag
For values >10uH, we recommend the  RFC0807B for new designs. The RFC series is a halogen-free, drop-in replacement for the RFB and offers lower DCR and better current ratings. We will continue to manufacture and support all values of the RFB0807 series.

有关该元件的更多信息和规格。

前往系列
立即购买:
计数 单价
1 $1.41
150 $1.16
300 $0.87
600 $0.52
1050 $0.41
2550 $0.35
5100 $0.32
10000 $0.30

对于大批量采购或非库存产品，点击这里请求报价。

. 现货，可今天发货.

规格

Electrical specifications at 25°C.

零件号 1 电感 (µH) 2
(公差: ±10%) 		DCR max (Ω) 3 SRF typ (kHz) 4 Isat (mA) 5 Irms (mA) 6
20°C rise 40°C rise
RFB0807-123L 12000 46.0 600 80 100 130
注释
  1. When ordering, please specify termination code: e.g. RFB0807-183L
  2. Inductance tested at 100 kHz, 0.1 Vrms, 0 Adc on an Agilent/HP 4284A LCR-meter or equivalent.
  3. DCR at 25°C. For other operating temperatures, use this DCR at Temperature calculator.
  4. SRF measured using an Agilent/HP 4191A or equivalent. Details
  5. Isat: DC current at 25°C that causes a 10% (typ) inductance drop from its value without current. Temperature derating curves.
  6. Irms: Current that causes the specified temperature rise from 25°C ambient. This information is for reference only and does not represent absolute maximum ratings. Temperature derating curves.

端子:

  • L = RoHS compliant tin-silver over tin over copper over steel.
  • T = RoHS tin-silver-copper (95.5/4/0.5). (Special order, added cost)
  • S = non-RoHS tin-lead (63/37). (Special order, added cost)
环境
环境:
符合RoHS
环境温度范围:
−40°C to +85°C with (40°C rise) Irms
储存温度范围:
Component: –40°C to +125°C.
Tray packaging: –40°C to +80°C
最高元件温度:
+125°C (Ambient + temperature rise)
故障率（FIT）/平均故障间隔时间（MTBF）:
See FIT/MTBF Calculations

性能曲线

Inductance vs. Current

Inductance vs. Current

Inductance vs. Frequency

Inductance vs. Frequency

物理特性

rfb0807d.gif

dims_inches_mm.gif
 

一般规格

核心材料:
Ferrite
重量:
1.22 – 1.46 g
包装:
150 parts per tray

焊接/清洗

湿气敏感度等级（MSL）:
1 (unlimited floor life at <30°C / 85% relative humidity)
抗焊接热:
Three reflows at >217°C for 90 seconds (+260°C ±5°C for 20 – 40 seconds), allowing parts to cool to room temperature between
焊接之前，请参阅焊接线艺元件。
PCB清洗:
Tested with pure water or alcohol only. More info.

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