 
XFL4020 Series Ultra-Low DCR
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| XFL4020-102ME_ | 1.0 | 10.80 | 11.9 | 64 | 4.5 | 5.1 | 5.4 | 8.0 | 11 |
| XFL4020-152ME_ | 1.5 | 14.40 | 15.8 | 59 | 4.1 | 4.4 | 4.6 | 6.7 | 9.1 |
| XFL4020-222ME_ | 2.2 | 21.35 | 23.5 | 38 | 3.1 | 3.5 | 3.7 | 6.0 | 8.0 |
| XFL4020-332ME_ | 3.3 | 34.80 | 38.3 | 33 | 2.7 | 2.8 | 2.9 | 3.9 | 5.2 |
| XFL4020-472ME_ | 4.7 | 52.20 | 57.4 | 26 | 2.0 | 2.5 | 2.7 | 3.6 | 5.0 |
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| 1 | When ordering, please specify packaging code: e.g. XFL4020-472MEC | |
| Packaging:
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C = 7"
machine-ready reel EIA-481 embossed plastic tape (1000 parts per full reel). B = Less than full reel In tape, but not machine-ready. To have a leader and trailer added ($25 charge), use code letter C instead. D = 13" machine-ready reel EIA-481 embossed plastic tape. Factory order only, not stocked (3500 parts per full reel). |
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| 2 | Inductance tested at 100 kHz, 0.1 Vrms, 0 Adc. | |
| 3 | DCR measured on a micro-ohmmeter. | |
| 4 | SRF measured using an Agilent/HP 4395A or equivalent. | |
| 5 | Isat: DC current at which the inductance drops the specified amount from its value without current. Details | |
| 6 | Irms: Current that causes the specified temperature rise from 25°C ambient. Irms testing was performed on 0.75 inch wide × 0.25 inch thick copper traces in still air. Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components. Therefore temperature rise should be verified in application conditions. | |
| 7 | Ambient temperature range: | –40°C to +125°C with Irms current. +125°C to +165°C with derated current. Derating curve |
| 8 | Storage temperature range: | Component: –40°C to +165°C Tape and reel packaging: –40°C to +80°C |
| 9 | Resistance to soldering heat: Three reflows at >217°C for 90 seconds (+260°C ±5°C for 20 – 40 seconds), allowing parts to cool to room temperature between. | |
| 10 | Electrical specifications at 25°C. | |
| Refer to Soldering Coilcraft Components before soldering. | ||
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