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UA8164-BE Coupled Inductor
for Microchip Technology

  • Designed to work in a flyback topology for a haptic driver circuit
  • Switching frequency: 300 kHz; Vin: 3.0 V; Vout: 230 V
  • 1 : 10 turns ratio
  • 200 Vrms winding-to-winding isolation (hipot)
  • RoHS-compliant. 260°C compatible. Matte tin over nickel over silver terminations

SPECIFICATIONS



Part number1
Click to get parts
Turns
ratio
Inductance2
±20% (µH)
DCR max
(Ohms)3
Capacitance4
max (pF)
Leakage
inductance5
max (µH)
Isat (A)6
L1 L2 L1       L2     
UA8164-BE_ 1 : 10 1.0 100 0.035 2.4 26.0 0.105 10.7
1 When ordering, please specify packaging code: e.g. UA8164-BEC
Packaging: C = 7" machine-ready reel
EIA-481 embossed plastic tape 250 parts per full reel).
B = Less than full reel
In tape, but not machine-ready. To have a leader and trailer added ($25 charge), use code letter C instead.
D = 13" machine-ready reel
EIA-481 embossed plastic tape. Factory order only, not stocked (1000 parts per full reel).
2 Inductance is measured at 100 kHz, 0.1 Vrms, 0 Adc on an Agilent/HP 4284A LCR meter or equivalent.
3 DCR at 25°C. For other operating temperatures, use this DCR at Temperature calculator.
4 Capacitance measured at 100 kHz, 0.1 Vrms.
5 Leakage inductance is for L1 and is measured at 100 kHz, 0.1 Vrms with L2 shorted
6 Isat: DC current applied to L1 at which the inductance drops 10% from its value without current.
7 Ambient temperature range: −40°C to +85°C with Irms current.
8 Storage temperature range: Component: −40°C to +125°C.
Tape and reel packaging: −40°C to +80°C
9 Maximum part temperature: +125°C (Ambient + temperature rise)
10 Resistance to soldering heat: Three reflows at >217°C for 90seconds (+260°C ±5°C for 20 – 40 seconds), allowing parts to cool to room temperature between.
11 Electrical specifications at 25°C.
Refer to Soldering Coilcraft Components before soldering.
PCB washing: Tested to MIL-STD-202 Method 215 plus an additional aqueous wash. More info.

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Updated: September 07, 2017