Soldering Coilcraft Components

Concerns regarding the use of water-soluble flux

Water soluble fluxes can leave weak organic acid (WOA) residues that must be thoroughly removed from all pc board components. All fine wire components, like many inductors, should be considered potentially susceptible.

Thorough rinsing and drying is required to remove water-soluble flux residue from all pc board areas, especially irregular component surfaces where contaminants can easily collect. If not removed completely, water-soluble flux residue can cause immediate or latent corrosion. 

Coilcraft strongly recommends consulting both the solder and water-soluble flux manufacturer for complete application information.

For further reference:

Kester, Inc.

Kester, Inc. Knowledge Data Base Article

Indium Corporation of America

Alpha Metals

Soldering surface mount components

  Download Application Note – Soldering surface mount components

All our RoHS-compliant parts are backward compatible with tin-lead soldering processes.

For all soldering methods, the optimal reflow profile for a circuit board assembly is dependent on the solder material, solder amount, flux, temperature limit of each soldered component, heat transfer characteristics of the circuit board and component materials, and the layout of all components.

The temperature vs. time limitation of the least robust component of the circuit board assembly ultimately dictates the optimal temperature profile. For this reason, Coilcraft does not provide soldering profiles for our components.