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Miniature Surface Mount
Transformers

New RoHS part numbers are shown. These redesigned parts are more cost effective than the non_RoHS parts. The next to the last character is now L to indicate RoHS compliance. (Old data sheet can be viewed here.)

  • Designed specifically for use with Maxim RS-232 / RS-485 interface ICs
  • Specified by Linear Technology and Sipex
  • Also suitable for gate drive and other power applications
  • 1500 Vrms isolation between windings
  • Miniature surface mount package
  • RoHS-compliant. 260°C compatible. Tin-silver over tin over nickel over phos bronze terminations.

SPECIFICATIONS

  Chipset
Linear
LT1952
Linear
LTC3900
Maxim
250/251
Maxim
253/845
Sipex
SP3222
Sipex
SP3232
 Q4470-CL      
 S5394-CL           
 U6982-CL      
 T6437-DL          
 S5499-DL          
 T6650-DL           

Q4470-CL_ 5 V to 5 V 400 (1-3) 27 (1-3) 0.950 (1-3)
1.25 (6-4)
1500
(1-4)
C 1 CT : 1.3 CT

S5394-CL_ 5 V to 10 V 400 (1-3) 27 (1-3) 0.950 (1-3, 6-4) 1500
(1-4)
C 1 CT : 1

U6982-CL_ 3.3 V to 5 V 59 (1-3) 22 (1-3) 0.700 (1-3)
1.800 (6-4)
1500
(1-4)
C 1 CT :  2.1 CT

T6437-DL_ 5 V to 5V 1000 (1-4) 134 (1-4) 1.010 (1-2, 3-4)
1.955 (8-5)
1500
(1,3-8)
D 1 CT : 1

S5499-DL_ 5 V to 24 V 40 (2-1) 48 (1-4) 0.540 (2-1, 4-3)
4.28 (5-6, 7-8)
1500
(1,3-8,6)
D 1 CT : 5 CT

T6650-DL_ 5 V to 24 V 176 (2-3) 48 (2-3) 1.015 (2-3)
8.250 (7-6)
1500
(3-6)
D 1 : 5
1 When ordering, please specify packaging code: e.g. Q4470-CLD
  Packaging: D = 13" reel, machine-ready 
EIA-481 embossed plastic tape (1000 parts per full reel).
B = Less than full reel
In tape, not machine ready. To have a leader and trailer added ($25 charge), use code letter D instead.
2 CT indicates center tap
3 Ambient temperature range: –40°C to +85°C
4 Storage temperature range: Component: –40°C to +85°C
Packaging: –55°C to +80°C
5 Resistance to soldering heat: Three reflows at >217°C for 90 seconds (+260°C ±5°C for 20 – 40 seconds), allowing parts to cool to room temperature between.
6 Electrical specifications at 25°C.
Refer to Soldering Coilcraft Components before soldering.

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Updated: June 16, 2008