 UA8164-BE Coupled Inductor
for Microchip Technology
- Designed to work in a flyback topology for a haptic driver circuit
- Switching frequency: 300 kHz; Vin: 3.0 V; Vout: 230 V
- 1 : 10 turns ratio
- 200 Vrms, 2 seconds winding-to-winding isolation (hipot)
- RoHS-compliant. 260°C compatible.
Matte tin over nickel over silver terminations
Pricing
PDF data sheet
SPECIFICATIONS
L vs
Frequency L vs Current Schematic
Dimensions
Tape and reel specifications 3D model
1 |
When
ordering, please specify packaging code: e.g.
UA8164-BEC |
|
Packaging:
|
C = 7"
machine-ready reel
EIA-481 embossed plastic tape 250 parts per full reel).
B = Less than full reel
In tape, but not machine-ready. To have a leader and trailer added ($25 charge),
use code letter C instead.
D = 13" machine-ready reel
EIA-481 embossed plastic tape. Factory order only, not stocked (1000 parts
per full reel). |
2 |
Inductance is measured at 100 kHz, 0.1 Vrms, 0 Adc on an Agilent/HP 4284A LCR meter or equivalent. |
3 |
DCR at 25°C. For other operating temperatures, use this
calculator. |
4 |
Capacitance measured at 100 kHz, 0.1 Vrms. |
5 |
Leakage inductance is for L1 and is measured at 100 kHz, 0.1 Vrms with L2 shorted |
6 |
Isat:
DC current applied to L1 at which the inductance drops 10% from its value without current. |
7 |
Ambient temperature range: |
−40°C to +85°C with Irms current. |
8 |
Storage temperature range: |
Component: −40°C to +125°C.
Tape and reel packaging: −40°C to +80°C |
9 |
Maximum part temperature: +125°C (Ambient + temperature rise) |
10 |
Resistance to soldering heat: Three reflows at >217°C for 90seconds (+260°C ±5°C for 20 – 40 seconds), allowing parts to cool to room temperature between. |
11 |
Electrical specifications at 25°C. |
Refer to Soldering Coilcraft Components before soldering. |
PCB washing: Tested to MIL-STD-202 Method 215 plus an additional aqueous wash. More info. |
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