RF Inductor Tools
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LC Filter Designer
IC / Inductor Match Tool
SLR1190 Series High Current
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|Isat (A)4||Irms (A)5|
|at 25°C||at 100°C||at 125°C||20°C rise||40°C rise|
|1||When ordering, please specify packaging code: e.g. SLR1190-311KEC|
C = 7" reel, machine-ready
EIA-481 embossed plastic tape (100 parts per full reel).
B = Less than full reel
In tape, but not machine-ready. To have a leader and trailer added ($25 charge), use code letter C instead.
D = 13" machine-ready reel
EIA-481 embossed plastic tape. Factory order only, not stocked (450 parts per full reel).
|2||Inductance tested at 100 kHz, 0.1 Vrms using an Agilent/HP 4284.|
|3||DCR measured at 25°C on a micro-ohmmeter at the points indicated in this diagram. For other operating temperatures, use this DCR at Temperature calculator.|
|4||Isat: DC current that causes a 20% (typ) inductance drop from its value without current.
Temperature derating curves.
|5||Irms: Current that causes the specified temperature rise from 25°C ambient. This information is for reference only and does not represent absolute maximum ratings. Temperature derating curves.
Irms testing was performed on 0.75 inch wide × 0.25 inch thick copper traces in still air. Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components. Therefore temperature rise should be verified in application conditions.
|6||Ambient temperature range:||−40°C to +85°C with (40°C rise) Irms Derating curves|
|7||Storage temperature range:||Component: −40°C to +125°C
Tape and reel packaging: −40°C to +80°C
|8||Maximum part temperature: +125°C (Ambient + temperature rise)|
|9||Resistance to soldering heat: Three reflows at >217°C for 90 seconds (+260°C ±5°C for 20 – 40 seconds), allowing parts to cool to room temperature between.|
|10||Electrical specifications at 25°C.|
|Refer to Soldering Coilcraft Components before soldering.|
|PCB washing: Tested to MIL-STD-202 Method 215 plus an additional aqueous wash. More info.|