XEL5050 Series

Ultra-Low Loss Shielded Power Inductors

Great News! More choices!

See XGL4020 and XGL4030 to save up to 35% board space.

See XGL5050 for significantly lower DCR (up to 35% lower) and higher L values (up to 33 µH)

XEL5050 high-performance molded power inductors feature very low AC losses at high frequencies and very low DCR. These rugged inductors are magnetically shielded for high-density power applications and exhibit soft saturation to withstand high peak current.

Low inductance values for high-frequency applications
Very low AC losses at high frequency and very low DCR
Soft saturation to withstand high current spikes
Magnetically shielded
Composite construction minimizes audible buzzing
No thermal aging – perfect for high-temperature applications
AEC-Q200 Grade 1 (−40°C to +125°C) with a 165°C max part temperature

Jetzt kaufen:

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Anzahl	Einzelpreis
1	$2,74
100	$2,40
250	$1,81
500	$1,09
1000	$0,85
2500	$0,73
5000	$0,67

Für große Mengen oder nicht vorrätige Artikel bitte ein Angebot anfordern.

Termination

E = Tin-silver (96.5/3.5) over copper

Packaging

C = 7" machine-ready reel

Tolerance

M = 20%

. Auf Lager, noch heute versandbereit.

Muster anfordern:

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Designer-Kits:

Kit	Werte	Preis
C480	32 (3 of each)	$120,00

Technische Daten

Electrical specifications at 25°C. Operating voltage 0 – 80 V

Teilenummer 1	Induktivität (µH) 2 (Toleranz: ±20%)	DCR (mΩ) 3		SRF typ (MHz) 4	Isat (A) 5			Irms (A) 6
Teilenummer 1	Induktivität (µH) 2 (Toleranz: ±20%)	typ	max	SRF typ (MHz) 4	10% drop	20% drop	30% drop	20°C rise	40°C rise
XEL5050-141ME_	0,14	1,5	1,8	189	16,1	27,0	39,0	24,6	35,1
XEL5050-281ME_	0,28	2,2	2,6	117	11,9	20,0	28,0	22,2	30,1
XEL5050-471ME_	0,47	3,0	3,6	78	9,3	15,3	21,0	18,8	26,0
XEL5050-681ME_	0,68	3,8	4,6	68	8,0	13,1	18,2	15,8	22,0
XEL5050-901ME_	0,90	4,7	5,6	60	7,5	12,4	17,2	14,3	19,6
XEL5050-122ME_	1,2	5,4	6,5	51	6,8	11,0	15,2	12,8	17,3
XEL5050-182ME_	1,8	7,8	9,3	43	5,7	9,3	12,8	10,5	14,4
XEL5050-222ME_	2,2	10,4	12,4	38	4,3	6,9	9,5	9,0	12,1
XEL5050-332ME_	3,3	13,3	14,6	31	3,8	6,2	8,4	7,8	10,6
XEL5050-472ME_	4,7	19,6	21,5	24	3,2	5,3	7,4	5,9	8,1
XEL5050-562ME_	5,6	22,6	24,8	23	2,9	4,8	6,6	5,5	7,6
XEL5050-682ME_	6,8	26,8	29,5	21	2,6	4,3	6,0	4,7	6,4
XEL5050-822ME_	8,2	31,8	35,0	18	2,3	3,9	5,6	4,5	6,1
XEL5050-103ME_	10	40,9	45,0	15	2,1	3,5	4,9	3,6	4,9
XEL5050-153ME_	15	69,7	76,7	13	1,7	2,9	3,7	2,9	3,9
XEL5050-223ME_	22	90,6	99,7	11	1,5	2,7	3,6	2,5	3,4

Hinweise

When ordering, please specify termination and packaging codes: e.g. XEL5050-223MEC
Inductance tested at 1 MHz, 0.1 Vrms, 0 Adc.
DCR measured at 25°C on a micro-ohmmeter. For other operating temperatures, use this DCR at Temperature calculator.
SRF measured using an Agilent/HP 4395A or equivalent.
Isat: DC current at 25°C that causes a 30% (typ) inductance drop from its value without current. Temperature derating curves.
Irms: Current that causes the specified temperature rise from 25°C ambient. This information is for reference only and does not represent absolute maximum ratings. Temperature derating curves.
Irms testing was performed on 0.75 inch wide × 0.25 inch thick copper traces in still air. Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components. Therefore temperature rise should be verified in application conditions.

Anschlüsse:

E = Halogen free component. RoHS compliant tin-silver over copper terminations.
T = RoHS tin-silver-copper (95.5/4/0.5). (Special order, added cost)
S = non-RoHS tin-lead (63/37). (Special order, added cost)

Verpackung:

C = 7″ machine-ready reel. EIA-481 embossed plastic tape (250 parts per full reel). Quantities less than full reel available: in tape (not machine ready) or with leader and trailer ($25 charge).
D = 13″ machine-ready reel. EIA-481 embossed plastic tape. Factory order only, not stocked (750 parts per full reel).

Umwelt/Umgebung

Umwelt/Umgebung:

RoHS-konform , Halogenfrei

Umgebungstemperaturbereich:

–40°C to +125°C with (40°C rise) Irms

Lagertemperaturbereich:

Component: –55°C to +165°C.
Tape and reel packaging: –55°C to +80°C

Maximale Bauteiltemperatur:

+165°C (ambient + temp rise)

Ausfälle pro Zeiteinheit (FIT) / Mittlere Ausfallzeit (MTBF):

See FIT/MTBF Calculations