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XFL5015 Series Low Profile
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|DCR (mOhms)3||SRF typ4
|Isat (A)5||Irms (A)6|
|typ||max||10% drop||20% drop||30% drop||20°C rise||40°C rise|
|1||When ordering, please specify termination and packaging codes: e.g. XFL5015-152MEC|
E = Halogen free component. RoHS compliant tin-silver over copper terminations.
Special order, added cost: T = RoHS tin-silver-copper (95.5/4/0.5) or
S = non-RoHS tin-lead (63/37).
|Packaging:||C = 7"
EIA-481 embossed plastic tape (1000 parts per full reel).
B = Less than full reel
In tape, but not machine-ready. To have a leader and trailer added ($25 charge), use code letter C instead.
D = 13" machine-ready reel
EIA-481 embossed plastic tape. Factory order only, not stocked (3000 parts per full reel).
|2||Inductance tested at 1 MHz, 0.1 Vrms, 0 Adc.|
|3||DCR measured at 25°C on a micro-ohmmeter. For other operating temperatures, use this DCR at Temperature calculator.|
|4||SRF measured using an Agilent/HP 4395A or equivalent.|
|5||Isat: DC current at 25°C that causes an inductance drop of 30% (typ) from its value without current.
Temperature derating curves.
|6||Irms: Current that causes the specified temperature rise from 25°C ambient. This information is for reference only and does not represent absolute maximum ratings. Temperature derating curves.
Irms testing was performed on 0.75 inch wide × 0.25 inch thick copper traces in still air. Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components. Therefore temperature rise should be verified in application conditions.
|7||Ambient temperature range:||−40°C to +125°C with (40°C rise) Irms Derating curves|
|8||Storage temperature range:||Component: −40°C to +165°C
Tape and reel packaging: −40°C to +80°C
|9||Maximum part temperature: +165°C (Ambient + temperature rise)|
|10||Resistance to soldering heat: Three reflows at >217°C for 90 seconds (+260°C ±5°C for 20 – 40 seconds), allowing parts to cool to room temperature between.|
|11||Electrical specifications at 25°C.|
|Refer to Soldering Coilcraft Components before soldering.|
|PCB washing: Tested to MIL-STD-202 Method 215 plus an additional aqueous wash. More info.|