"Spring" Air Core Inductor
Qualification Standards

All tests are performed in accordance with AEC-Q200-REV C.

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General

Operating temperature range

Specification

-40° C to +125° C.

Insulation resistance

Specification

1000 Megohms minimum.

Test method/condition

100 Vdc between inductor terminals and center case.

Dielectric withstanding voltage

Specification

No evidence of voltage breakdown.

Test method/condition

500 Vac between inductor terminals and center of case for a maximum of 1 minute.

Environment/Life

Specification

+5 to +70 ppm/°C typical over operating temperature range, from DC to SRF.

Test method/condition

Inductors shall be placed in an LC oscillator circuit. The inductor will be the only portion of the circuit in the environment chamber. The change in L will be indicated by the change in f and calculated using the following equation.

Specification

Inductance must not change more than the stated tolerance.

Test method/condition

Inductors shall be subjected to 85°C, 85% relative humidity for 1000 hours. Inductors are to be tested after being air dried for one day.

Thermal shock

Specification

There shall be no case deformation or change in dimensions.

Inductance must not change more than the stated tolerance.

Test method/condition

Inductors shall be subjected 300 times to the following temperature cycle: -40°C for 15 minutes to maximum operating temperature for 15 minutes; transition time less than 20 seconds.
Inductors are to be tested after one day at room temperature.

Thermal cycling

Specification

There shall be no case deformation or change in dimensions.

Inductance must not change more than the stated tolerance.

Test method/condition

Inductors shall be subjected 1000 times to the following temperature cycle: -40°C for 15 minutes to maximum operating temperature for 15 minutes; transition time 10 minutes. Inductors are to be tested after one day at room temperature.

Low temperature storage

Specification

There shall be no case deformation or change in dimensions.

Inductance shall not change more than ±5%.

Test method/condition

Inductors shall be subjected to -55°C ±2°C for 1000 hours.

Inductors are to be tested after one day at room temperature.

Specification

Inductors must not have a shorted or open winding.

Test method/condition

Inductors shall be stored at maximum operating temperature for 1000 hours with rated current applied. Inductor shall be tested at start of test and at 1000 hours. Inductors are to be tested after one day at room temperature.

Board flex

Specification

There must be no case deformation or open circuit during test.

Test method/condition

Inductors shall be mounted to PC board. Apply force to center of PC board to flex 2 mm min.

Moisture resistance

Specification

Inductors must not have a shorted or open winding.

Test method/condition

Inductors shall be subjected to ten 24-hour cycles at 25°C to 65°C at 80 to 95% relative humidity, per MIL-STD202 Method 106. During any one of the first nine cycles, inductors are to be removed from the chamber and exposed for 3 hours to -10°C. Inductors are to be tested after one day at room temperature.

Vibration

Specification

There must be no case deformation or change in dimensions.

Inductance shall not change more than stated tolerance.

Test method/condition

Test per MIL-STD 202 method 213 test condition C. Test mounted samples in three axes, six times, totaling 18 shocks (100 G, 6 ms, half-sine).

Other

Specification

The metalized area must have 90% minimum solder coverage.

Test method/condition

Dip pads in flux (Alpha 100 or equiv.) and dip in solder pot (96.5 Sn/3.0 Ag/0.5 Cu or 63 Sn/37 Pb solder) at 232°C ±5°C for five seconds.

Specification

There must be no case deformation or change in dimensions.

Inductance shall not change more than the stated tolerance.

Test method/condition

Test per MIL-STD-202 Method 210 Condition B. Inductors shall be reflowed three times onto a PC board using 96.5 Sn/3.0 Ag/0.5 Cu or 63 Sn/37 Pb solder paste. Allow 24 hours between reflows.

For 96.5 Sn/3.0 Ag/0.5 Cu solder paste: >217°C for 90 seconds.
Solder process shall be at a maximum temperature of 260°C.

For 63 Sn/37 Pb solder paste: >183°C for 120 seconds.
Solder process shall be at a maximum temperature of 235°C.

Component adhesion (push test)

Specification

"Mini Spring" (AXXT, BXXT) series - 1.8 kg
All others - 1.0 kg

Test method/condition

Inductors shall be reflow soldered (260°C ±5°C for 10 seconds) to a tinned copper substrate. A force gauge shall be applied to the side of the component. The device must withstand the stated force without a failure of the termination to component attachment.

Specification

There must be no case deformation, change in dimensions, or obliteration of marking.

Test method/condition

Inductors must withstand 6 minutes of alcohol.

Specification

IEC 60695-2-2

Test method/condition

Inductors must withstand needle-flame test.