SMT Power Inductor
Qualification Standards

All tests are performed in accordance with AEC-Q200-REV C.

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General

Operating temperature range

Specification

As specified on component data sheet.

Environmental/Life

Specification

There must be no change in appearance.

Inductance must not change more than stated tolerance.

Test method/condition

Inductors shall be subjected to 85°C, 85% relative humidity for 1000 hours.

Inductors are to be tested after being air dried for one day.

Specification

There must be no change in appearance.

Inductance must not change more than stated tolerance.

Test method/condition

Inductors shall be subjected to -55°C ±2°C for 1000 hours.

Inductors are to be tested after one day at room temperature.

Specification

Inductors must not have a shorted or open winding.

Test method/condition

Inductors shall be stored at maximum operating temperature for 1000 hours with rated current applied. Inductors shall be inspected at start of test and at 1000 hours.

Inductors are to be tested after one day at room temperature.

Board flex

Specification

There must be no case deformation or open circuit during test.

Test method/condition

Inductors shall be mounted to PC board. Apply force to center of PC board to flex 2 mm min.

Specification

Inductors must not have a shorted or open winding.

Test method/condition

Inductors shall be subjected to ten 24-hour cycles at 25°C to 65°C at 80 to 95% relative humidity, per MIL-STD202 Method 106. Inductors are to be tested after one day at room temperature.

Vibration

Specification

There must be no case deformation or change in dimensions.

Inductance shall not change more than stated tolerance.

Test method/condition

Inductors shall be vibrated for 20 minutes at 5 G from 10 Hz to 2000 Hz per MIL-STD 202 Method 204.

Mechanical shock

Specification

There must be no case deformation or change in dimensions.

Inductance shall not change more than stated tolerance.

Test method/condition

Test per MIL-STD 202 method 213 test condition C. Test mounted samples in three axes, six times, totaling 18 shocks (100 G, 6 ms, half-sine).

Other

Specification

The metalized area must have 90% minimum solder coverage.

Test method/condition

Dip pads in flux (Alpha 100 or equivalent) and dip in solder pot ( 96.5 Sn/3.0 Ag/0.5 Cu or 63 Sn/37 Pb solder) at 232°C ±5°C. For parts less than or equal to 0.195" (4.95 mm) in length or width, dip for 5 seconds. For parts greater than 0.195" (4.95 mm) in length or width, dip for 20 seconds.

Specification

There must be no case deformation or change in dimensions.
Inductance shall not change more than the stated tolerance.

Test method/condition

Test per MIL-STD-202 Method 210 Condition B. Inductors shall be reflowed three times onto a PC board using 96.5 Sn/3.0 Ag/0.5 Cu or 63 Sn/37 Pb solder paste. Allow 24 hours between reflows.

For 96.5 Sn/3.0 Ag/0.5 Cu solder paste: >217°C for 90 seconds.
Solder process shall be at a maximum temperature of 260°C.

For 63 Sn/37 Pb solder paste: >183°C for 120 seconds.
Solder process shall be at a maximum temperature of 235°C.

Component adhesion (push test)

Specification

2.7 kg

Test method/condition

Inductors shall be reflow soldered (260°C ±5°C for 10 seconds) to a tinned copper substrate. A force gauge shall be applied to the side of the component. Inductors must withstand the stated force without a failure of the termination to component attachment.

Specification

There must be no change in appearance or obliteration of marking.

Test method/condition

Inductors must withstand 6 minutes of alcohol.

Specification

IEC 60695-2-2

Test method/condition

Inductors must withstand needle-flame test.