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Chip Inductor Qualification Standards

All tests are performed in accordance with AEC-Q200-REV C.

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Board flex Low temperature storage Solderability
Coefficient of expansion Mechanical shock Static humidity
Component adhesion (push test) Moisture resistance Temperature coefficient of inductance
Dielectric withstanding voltage Operating temperature range Thermal cycling
Flammability Reliability (FITs, MTBF) Thermal shock
High temperature load life Resistance to soldering heat Vibration
Insulation resistance Resistance to solvent  

General

Operating temperature range

Specification
Ceramic core: -40°C to +125°C.
Ferrite core: -40°C to +85°C.
XXXXTC, XXXXRV series: -40°C to +125°C.

Coefficient of expansion (TCE)

Specification
6.7ppm/°C (typical).

Insulation resistance

Specification
1000 megohms minimum.
Test method/condition
100 Vdc between inductor terminals and center case.

Dielectric withstanding voltage

Specification
No evidence of voltage breakdown.
Test method/condition
500 Vac between inductor terminals and center of case for a maximum of 1 minute.

Environment/Life

Temperature coefficient of inductance (TCL)
Specification
Ceramic core
(series ending in CS, HS, HQ, HT and  CT):
+25 to +125 ppm/°C typical over operating temperature and frequency range specified in product table.
Test method/condition
Inductors shall be placed in an LC oscillator circuit. The inductor will be the only portion of the circuit in the environment chamber. The change in L will be indicated by the change in f and calculated using the following equation.
Specification
Ferrite core
(series ending in AF, LS,  RV and TC)
0402 size:
+25 to +150 ppm/°C typical over operating temperature range, from DC to SRF.
0603 size:
+50 to +150 ppm/°C typical over operating temperature range, from DC to SRF.
0805 size:
+100 to +250 ppm/°C typical over operating temperature range, from DC to SRF.
1008 size:
+100 to +350 ppm/°C typical over operating temperature range, from DC to SRF.
1812 size:
+200 to +700 ppm/°C typical over operating temperature range, from DC to SRF.
4308 size:
+200 to +700 ppm/°C typical over operating temperature range, from DC to SRF.
4312 size:
+300 to +1100 ppm/°C typical over operating temperature range, from DC to SRF.
4513 size:
+50 to +210 ppm/°C typical over operating temperature range, from DC to SRF.
5315 size:
+300 to +1100 ppm/°C typical over operating temperature range, from DC to SRF.
Test method/condition (except series ending in LS)
TCL is measured directly using an Agilent/HP 4263 LCR meter.
Test method/condition (series ending in LS)
Inductors shall be placed in an LC oscillator circuit. The inductor will be the only portion of the circuit in the environment chamber. The change in L will be indicated by the change in f and calculated using the following equation.

Static humidity

Specification
Inductance must not change more than the stated tolerance.
Test method/condition
Inductors shall be subjected to 85°C, 85% relative humidity for 1000 hours. Inductors are to be tested after being air dried for one day.

Thermal shock

Specification
There shall be no case deformation or change in dimensions.
Inductance must not change more than the stated tolerance.
Test method/condition
Inductors shall be subjected 300 times to the following temperature cycle: -40°C for 15 minutes to maximum operating temperature for 15 minutes; transition time less than 20 seconds.
Inductors are to be tested after one day at room temperature.

Thermal cycling

Specification
There shall be no case deformation or change in dimensions.
Inductance must not change more than the stated tolerance.
Test method/condition
Inductors shall be subjected 1000 times to the following temperature cycle: -40°C for 15 minutes to maximum operating temperature for 15 minutes; transition time 10 minutes. Inductors are to be tested after one day at room temperature.

Low temperature storage

Specification
There shall be no case deformation or change in dimensions.
Inductance shall not change more than ±5%.
Test method/condition
Inductors shall be subjected to -55°C ±2°C for 1000 hours.
Inductors are to be tested after one day at room temperature.
High temperature load life
Specification
Inductors must not have a shorted or open winding.
Test method/condition
Inductors shall be stored at maximum operating temperature for 1000 hours with rated current applied. Inductor shall be tested at start of test and at 1000 hours. Inductors are to be tested after one day at room temperature.

Board flex

Specification
There must be no case deformation or open circuit during test.
Test method/condition
Inductors shall be mounted to PC board. Apply force to center of PC board to flex 2 mm min.
Moisture resistance
Specification
Inductors must not have a shorted or open winding.
Test method/condition
Inductors shall be subjected to ten 24-hour cycles at 25°C to 65°C at 80 to 95% relative humidity, per MIL-STD202 Method 106. Inductors are to be tested after one day at room temperature.

Other

Solderability
Specification
The metalized area must have 90% minimum solder coverage.
Test method/condition
Dip pads in flux (Alpha 100 or equivalent) and dip in solder pot (63 Sn/37 Pb or 96.5 Sn/3.0 Ag/0.5 Cu solder) at 232°C ±5°C. For parts less than or equal to 0.195" (4.95 mm) in length or width, dip for 5 seconds. For parts greater than 0.195" (4.95 mm) in length or width, dip for 20 seconds.
Resistance to soldering heat
Specification
There must be no case deformation or change in dimensions.

Inductance shall not change more than the stated tolerance.

Test method/condition

Test per MIL-STD-202 Method 210 Condition B. Inductors shall be reflowed three times onto a PC board using 96.5 Sn/3.0 Ag/0.5 Cu or 63 Sn/37 Pb solder paste. Allow 24 hours between reflows.

For 96.5 Sn/3.0 Ag/0.5 Cu solder paste: >217°C for 90 seconds.
Solder process shall be at a maximum temperature of 260°C.

For 63 Sn/37 Pb solder paste: >183°C for 120 seconds.
Solder process shall be at a maximum temperature of 235°C.

Vibration
Specification
There must be no case deformation or change in dimensions.
Inductance shall not change more than stated tolerance.
Test method/condition
Inductors shall be vibrated for 20 minutes at 5 G from 10 Hz to 2000 Hz per MIL-STD 202 Method 204.
Mechanical shock
Specification
There must be no case deformation or change in dimensions.
Inductance shall not change more than stated tolerance.
Test method/condition
Test per MIL-STD 202 method 213 test condition C. Test mounted samples in three axes, six times, totaling 18 shocks (100 G, 6 ms, half-sine).
Component adhesion (push test)
Specification
0201 Series — 115 g
0302 Series — 295 g
0402 Series — 450 g
0403 Series — 450 g
0603 Series — 900 g
0604 Series — 900 g
0805 Series and larger — 1.8 kg
Test method/condition
Inductors shall be reflow soldered (262°C ±5°C for 10 seconds) to a tinned copper substrate. A force gauge shall be applied to the side of the component. The device must withstand the stated force without a failure of the termination to component attachment.
Resistance to solvent
Specification
There must be no case deformation, change in dimensions, or obliteration of marking.
Test method/condition
Inductors must withstand 6 minutes of alcohol.
Flammability
Specification
IEC 60695-2-2
Test method/condition
Inductors must withstand needle-flame test.

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Updated: February 18, 2008