Power Chip Inductor
Qualification Standards
All tests are performed in accordance with AEC-Q200-REV C.
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General
Operating temperature range
- Specification
- 0603PS: -40°C to +65°C.
0805PS: -40°C to +65°C.
1008PS: -40°C to +105°C.
1812PS: -40°C to +105°C.
XXXXDPS and XXXXFS series: -40°C to +85°C.
Coefficient of expansion (TCE)
- Specification
- 6.7ppm/°C (typical).
Insulation resistance
- Specification
- 1000 Megohms minimum.
- Test method/condition
- 100 Vdc between inductor terminals and center case.
Dielectric withstanding voltage
- Specification
- No evidence of voltage breakdown.
- Test method/condition
- 500 Vac between inductor terminals and center of case for a maximum
of 1 minute.
Environment/Life
Temperature coefficient of
inductance (TCL)
- Specification
-
0603PS:
+50 to +150 ppm/°C typical over operating temperature range, from DC to
SRF.
0805PS:
+100 to +250 ppm/°C typical over operating temperature range, from DC to
SRF.
1008PS:
+100 to +350 ppm/°C typical over operating temperature range, from DC to
SRF.
1812DPS, 1812FS, 1812PS:
+200 to +700 ppm/°C typical over operating temperature range, from DC to
SRF.
- Test method/condition
- TCL is measured directly using an Agilent/HP 4263
LCR meter.
Static humidity
- Specification
- Inductance must not change more than the stated
tolerance.
- Test method/condition
- Inductors shall be subjected to 85°C, 85% relative
humidity for
1000 hours. Inductors are to be tested after being air dried for one day.
Thermal shock
- Specification
- There shall be no case deformation or change in
dimensions.
- Inductance must not change more than the stated
tolerance.
- Test method/condition
- Inductors shall be subjected 300 times to the following temperature cycle: -40°C for 15 minutes to maximum operating temperature for 15 minutes; transition time less than 20 seconds.
Inductors are to be tested after one day at room temperature.
Thermal cycling
- Specification
- There shall be no case deformation or change in
dimensions.
- Inductance must not change more than the stated
tolerance.
- Test method/condition
- Inductors shall be subjected 1000 times to the following temperature cycle: -40°C for 15 minutes to maximum operating temperature for 15 minutes; transition time 10 minutes. Inductors are to be tested after one day at room temperature.
Low temperature storage
- Specification
- There shall be no case deformation or change in
dimensions.
- Inductance shall not change more than ±5%.
- Test method/condition
- Inductors shall be subjected to -55°C ±2°C for 1000 hours.
- Inductors are to be tested after one day at room temperature.
High temperature load life
- Specification
- Inductors must not have a shorted or open winding.
- Test method/condition
- Inductors shall be stored at maximum operating
temperature for 1000 hours with rated
current applied. Inductor shall be tested at start of test and at 1000 hours.
Inductors are to be tested after one day at room temperature.
Board flex
- Specification
- There must be no case deformation or open circuit during test.
- Test method/condition
- Inductors shall be mounted to PC board. Apply force to center of PC board to flex 2 mm min.
Moisture resistance
- Specification
- Inductors must not have a shorted or open winding.
- Test method/condition
- Inductors shall be subjected to ten 24-hour cycles at 25°C to 65°C at 80% to 95%
relative humidity, per MIL-STD202 Method 106.
Inductors are to be tested after one day at room temperature.
Vibration
- Specification
- There must be no case deformation or change in
dimensions.
- Inductance shall not change more than stated
tolerance.
- Test method/condition
- Inductors shall be vibrated for 20 minutes at 5 G from 10 Hz to 2000 Hz per MIL-STD 202 Method 204.
Mechanical shock
- Specification
- There must be no case deformation or change in
dimensions.
- Inductance shall not change more than stated
tolerance.
- Test method/condition
- Test per MIL-STD 202 method 213 test condition C. Test mounted samples in three axes, six times, totaling 18 shocks (100 G, 6 ms, half-sine).
Other
Solderability
- Specification
- The metalized area must have 90% minimum solder coverage.
- Test method/condition
- Dip pads in flux (Alpha 100 or equivalent) and dip in solder pot (96.5 Sn/3.0 Ag/0.5 Cu solder or 63 Sn/37 Pb) at 232°C ±5°C. For parts less than or equal to 0.195" (4.95 mm) in length or width, dip for 5 seconds. For parts greater than
0.195" (4.95 mm) in length or width, dip for 20 seconds.
Resistance to soldering heat
- Specification
- There must be no case deformation or change in
dimensions.
-
Inductance shall not change more than the stated
tolerance.
- Test method/condition
-
Test per MIL-STD-202 Method 210 Condition B. Inductors
shall be reflowed three times onto a PC board
using 96.5 Sn/3.0 Ag/0.5 Cu or 63 Sn/37 Pb
solder paste. Allow 24 hours between reflows.
-
For 96.5 Sn/3.0 Ag/0.5 Cu solder paste: >217°C for 90
seconds.
Solder process shall be at a maximum temperature of 260°C.
-
For 63 Sn/37 Pb solder
paste: >183°C for 120 seconds.
Solder process shall be at a maximum temperature of 235°C.
Component adhesion (push test)
- Specification
- 0603PS — 350 g
0805PS — 900 g
1008PS — 1.6 kg
1812DPS, 1812FS, 1812PS — 1.8 kg
- Test method/condition
- Inductors shall be reflow soldered (262°C ±5°C for
10 seconds) to a tinned copper substrate. A force gauge shall be applied
to the side of the component. The device must withstand the stated force
without a failure of the termination to component attachment.
Resistance to solvent
- Specification
- There must be no case deformation, change in
dimensions, or
obliteration of marking.
- Test method/condition
- Inductors must withstand 6 minutes of alcohol.
Flammability
- Specification
- IEC 60695-2-2
- Test method/condition
- Inductors must withstand needle-flame test.
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