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1812 (4532)

Ceramic Chip Inductors for DOCSIS 3.x

RoHS compliant
Our HA403x Series was designed for DOCSIS 3.x applications and has our highest Q factors in an 1812 footprint. It also features excellent current handling and very low DC resistance for lowest insertion loss.
  • Our highest Q factors in an 1812 form factor
  • Excellent current handling
  • Very low DCR
  • Inductance values from 39 nH to 390 nH

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Designer's Kit:
Kit Values Price
C458 6 (10 of each) $45.00

Specifications

Electrical specifications at 25°C.

Part number 1 Inductance (nH) 2
(Tolerance: ± 2%)
Q typ
@ 50.0 MHz 3
SRF typ (GHz) 4 DCR max (mΩ) 5 Irms (mA) 6
TA7849-AE_ 39 49 2.5 120 1100
TA7850-AE_ 47 55 1.9 110 1100
TA7851-AE_ 56 55 1.9 126 920
TA7852-AE_ 68 55 2.0 149 900
PA6691-AE_ 80 61 1.3 140 900
PA6692-AE_ 100 62 1.2 160 860
PA6693-AE_ 120 67 0.99 160 860
HA4031-AL_ 150 75 0.86 100 1150
HA4032-AL_ 180 80 0.85 105 1150
HA4033-AL_ 220 80 0.70 110 940
HA4034-AL_ 270 85 0.73 120 940
HA4035-AL_ 330 80 0.60 135 850
HA4036-AL_ 390 80 0.60 150 850
Notes
  1. When ordering, please specify termination and packaging codes: e.g. HA4031-ALC
  2. Inductance measured at 50 MHz, using a Coilcraft SMD-A fixture in an Agilent/HP 4286A impedance analyzer with Coilcraft-provided correlation pieces.
  3. Q measured measured at 50 MHz, using an Agilent/HP 4291A with an Agilent/HP 16193 test fixture.
  4. SRF measured using an Agilent/HP 8753D network analyzer and a Coilcraft SMD-D test fixture.
  5. DCR measured on a Cambridge Technology micro-ohmmeter and a Coilcraft CCF859 test fixture. For other operating temperatures, use this DCR at Temperature calculator.
  6. Current that causes a 15°C temperature rise from 25°C ambient.

Termination:

  • L = RoHS compliant silver-palladium-platinum-glass frit.
  • R = RoHS compliant matte tin over nickel over silver platinum-glass frit.
  • S = non-RoHS tin-lead (63/37). (Special order, added cost)
  • T = RoHS tin-silver-copper (95.5/4/0.5) (Special order, added cost)
  • P = non-RoHS tin-lead (63/37) over matte tin over nickel over silver-platinum-glass frit. (Special order, added cost)
  • Q = RoHS tin-silver-copper (95.5/4/0.5) over matte tin over nickel over silver-platinum-glass frit. (Special order, added cost)

Packaging:

  • C = 7" machine-ready reel
    EIA-481 embossed plastic tape (600 parts per full reel).
  • B = Less than full reel
    In tape, but not machine-ready. To have a leader and trailer added ($25 charge), use code letter C instead.
  • 13" reel, machine-ready 
    EIA-481 embossed plastic tape. Factory order only, not stocked (2200 parts per full reel).
Environmental
Environmental:
RoHS compliant
Ambient temperature range:
–40°C to +125°C with Irms current
Storage temperature range:
Component: –40°C to +140°C.
Tape and reel packaging: –40°C to +80°C
Maximum part temperature:
+140°C (ambient + temp rise)
Failures in Time (FIT) / Mean Time Between Failures (MTBF):

Performance curves

L vs Frequency

Q vs Frequency

L vs Frequency

Q vs Frequency

Physical characteristics

 ha4031d.gif

A max B max C max D ref E F G H I J  
0.195 0.150 0.135 0.070 0.100 0.025 0.128 0.120 0.045 0.118 inches
4,95 3,81 3,43 1,78 2,54 0,64 3,25 3,05 1,14 3,00 mm

Height dimension (C) is before optional solder application.
For maximum height dimension including solder, add 0.006 in / 0,152 mm

Tape and Reel specification

tapereel_pl.gif

Parts per reel Reel dimensions (mm) Tape dimensions (mm) Orientation
7" (178 mm) 13" (330 mm) A B C D E W P Po P1 H T part_or_i.gif
600 2200* 178/330 60/100 13 18,4 12,4 12 8 4 2 3,7 0,3

* Special order

General specification

Core Material:
Ceramic
Weight:
109 – 128 mg
Temperature coefficient of inductance:
+25 to +125 ppm/°C

Soldering/Washing

Moisture Sensitivity Level (MSL):
1 (unlimited floor life at <30°C / 85% relative humidity)
Resistance to soldering heat:
Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles
Refer to Soldering Coilcraft Components before soldering.
PCB Washing:
Tested to MIL-STD-202 Method 215 plus an additional aqueous wash. See Doc787_PCB_Washing.pdf.

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