Mid-Span PoE Plus Magnetics
for 30 W Applications

• Developed for PoE Plus applications in support of IEEE 802.3“at” working group
• Exceeds the return loss requirements of Gbit Ethernet
• Designed for 2-line systems
• 350 µH minimum at 20 mA offset current at 25°C
• Can handle 22.5 mA minimum dc offset at 85°C.
• Typical temperature rise: 7°C with 800 mA; 10°C with 1000 mA dc current applied.
• RoHS-compliant. 260°C compatible. Tin-silver-copper over tin over nickel over phos bronze terminations

Photo    Pricing    Materials declaration    PDF data sheet

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SPECIFICATIONS

 L vs Offset Current     Return Loss    Schematic     Dimensions   

Tape and reel specifications

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Part number1 Click for samples	Inductance2 min (µH)	Leakage inductance3 max (µH)	DCR4 (Ohms)
FA2536-AL_	675.0	0.55	0.240

1	When ordering, please specify packaging code: e.g. FA2536-ALD
	Packaging:	D = 13" machine-ready reel EIA 481 embossed plastic tape (400 parts per full reel) B = Less than full reel In tape, but not machine-ready. To have a leader and trailer added ($25 charge), use code letter D instead.

2	Inductance measured between pins 1 – 3 and between pins 4 – 6 at 100 kHz, 0.1 Vrms, 0 Adc using an Agilent/HP 4263B impedance analyzer.
3	Leakage inductance is measured between pins 2 and 3 with pins 1 and 3 shorted and between pins 5 and 6 with pins 4 and 6 shorted.
4	DCR is measured between pins 1 – 3 and between pins 4 – 6.
5	Ambient temperature range:	–40°C to +85°C
6	Storage temperature range:	Component: –40°C to +85°C Packaging: –55°C to +80°C
7	Resistance to soldering heat: Three reflows at >217°C for 90 seconds (+260°C ±5°C for 20 – 40 seconds), allowing parts to cool to room temperature between.
8	Electrical specifications at 25°C.
Refer to Soldering Coilcraft Components before soldering.