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Midspan PoE Plus Magnetics
for 30 W Applications

  • Developed for PoE Plus applications in support of IEEE 802.3“at” working group
  • Exceeds the return loss requirements of Gbit Ethernet
  • Designed for 2-line systems
  • 350 µH minimum at 20 mA offset current at 25°C
  • Can handle 22.5 mA minimum dc offset at 85°C.
  • Typical temperature rise: 7°C with 800 mA; 10°C with 1000 mA dc current applied.
  • RoHS-compliant. 260°C compatible. Tin-silver-copper over tin over nickel over phos bronze terminations

SPECIFICATIONS


Part number1
Click for samples
Inductance2
min (µH)
Leakage
inductance3
max (µH)
DCR4
(Ohms)
FA2536-AL_ 675.0 0.55 0.240
1 When ordering, please specify packaging code: e.g. FA2536-ALD
  Packaging: D = 13" machine-ready reel
EIA 481 embossed plastic tape (400 parts per full reel)
B = Less than full reel
In tape, but not machine-ready. To have a leader and trailer added ($25 charge), use code letter D instead.
2 Inductance measured between pins 1 – 3 and between pins 4 – 6 at 100 kHz, 0.1 Vrms, 0 Adc using an Agilent/HP 4263B impedance analyzer.
3 Leakage inductance is measured between pins 2 and 3 with pins 1 and 3 shorted and between pins 5 and 6 with pins 4 and 6 shorted.
4 DCR is measured between pins 1 – 3 and between pins 4 – 6. DCR measured at 25°C. For other operating temperatures, use this DCR at Temperature calculator.
5 Ambient temperature range: −40°C to +85°C
6 Storage temperature range: Component: −40°C to +85°C
Tape and reel packaging: −40°C to +80°C
7 Resistance to soldering heat: Three reflows at >217°C for 90 seconds (+260°C ±5°C for 20 – 40 seconds), allowing parts to cool to room temperature between.
8 Electrical specifications at 25°C.
Refer to Soldering Coilcraft Components before soldering.
PCB washing: Tested to MIL-STD-202 Method 215 plus an additional aqueous wash. More info

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Updated: March 23, 2017