Mid-Span PoE Plus Magnetics
for 30 W Applications
- Developed for PoE Plus applications in support of IEEE 802.3“at” working group
- Exceeds the return loss requirements of Gbit Ethernet
- Designed for 2-line systems
- 350 µH minimum at 20 mA offset current at 25°C
- Can handle 22.5 mA minimum dc offset at 85°C.
- Typical temperature rise: 7°C with 800 mA; 10°C with 1000 mA dc current applied.
- RoHS-compliant. 260°C compatible. Tin-silver-copper over tin over nickel over phos bronze terminations
Photo 
Pricing
Materials declaration 
PDF data sheet
SPECIFICATIONS
L
vs Offset Current
Return Loss 
Schematic 
Dimensions
| Part number1 Click for samples |
Inductance2 min (µH) |
Leakage inductance3 max (µH) |
DCR4 (Ohms) |
| FA2536-AL_ | 675.0 | 0.55 | 0.240 |
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| 1 | When ordering, please specify packaging code: e.g. FA2536-ALD | |
| Packaging: | D = 13"
machine-ready reel EIA 481 embossed plastic tape (400 parts per full reel) B = Less than full reel In tape, but not machine-ready. To have a leader and trailer added ($25 charge), use code letter D instead. |
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| 2 | Inductance measured between pins 1 – 3 and between pins 4 – 6 at 100 kHz, 0.1 Vrms, 0 Adc using an Agilent/HP 4263B impedance analyzer. | |
| 3 | Leakage inductance is measured between pins 2 and 3 with pins 1 and 3 shorted and between pins 5 and 6 with pins 4 and 6 shorted. | |
| 4 | DCR is measured between pins 1 – 3 and between pins 4 – 6. | |
| 5 | Ambient temperature range: | –40°C to +85°C |
| 6 | Storage temperature range: | Component: –40°C to +85°C Packaging: –40°C to +80°C |
| 7 | Resistance to soldering heat: Three reflows at >217°C for 90 seconds (+260°C ±5°C for 20 – 40 seconds), allowing parts to cool to room temperature between. | |
| 8 | Electrical specifications at 25°C. | |
| Refer to Soldering Coilcraft Components before soldering. | ||
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